Course Information
Course Aims
This course aims to provide a comprehensive introduction to the fabrication technologies of semiconductor devices. It covers essential topics including principles and design, in order to provide foundation knowledge of the functionality and applications of the devices. Students are taught to design device fabrication recipes, linking theory and practice so that the concepts learned in the course can be implemented. The processing technologies of semiconductor devices, from wafer growth to packaging, are explained in detail.
Up-to-date technology developments in semiconductor research and industry are discussed so that students keep abreast of the latest technological advances. The course also aims to familiarise students with the common semiconductor devices in the advanced manufacturing industry, so that they have the relevant background before embarking on an engineering career in that industry. The course is customised to meet the specific learning needs of MSPSI students, equipping them with a targeted set of knowledge, skills and competencies.
Intended Learning Outcomes (ILOs)
Upon successful completion of this course, students should have a good understanding of the following Semiconductor Processing Techniques (SPT):
| ILO | Learning Outcome |
|---|---|
| SPT 1 | Present a general view of the trend of semiconductor technology development and its technological ecosystem. |
| SPT 2 | Explain the importance of contamination control and apply the relevant approach in semiconductor processing. |
| SPT 3 | Describe the fabrication process of semiconductor wafers, and understand the techniques of growing thermal silicon dioxide. |
| SPT 4 | Describe the techniques of optical lithography and other advanced lithography techniques to achieve the minimum device feature size. |
| SPT 5 | Describe the techniques of wet and dry etching and pattern transfer to devices. |
| SPT 6 | Explain vacuum technology and design a desired vacuum condition by selecting suitable pumps and gauges. |
| SPT 7 | Describe metallic and dielectric film deposition processes and apply suitable tools to grow films. |
| SPT 8 | Design the doping concentration in bulk wafer fabrication, explain the physics of doping, and apply ion implantation conditions. |
| SPT 9 | Use appropriate metallic layers for the interconnect metallisation process. |
| SPT 10 | Describe the device packaging process and apply a suitable model for manufacturing yield calculation. |
| SPT 11 | Design an integrated process to complete CMOS transistor fabrication. |
Course Content
| Lecture | Topic |
|---|---|
| Lecture 1 | Introduction to Semiconductor Technology |
| Lecture 2 | Semiconductor Wafer |
| Lecture 3 | Lithography Techniques |
| Lecture 4 | Etching |
| Lecture 5 | Thin Film Deposition Techniques |
| Lecture 6 | Impurity Doping |
| Lecture 7 | Metallisation |
| Lecture 8 | Semiconductor Back-end Process and Yields |
| Lecture 9 | CMOS Device Fabrication |
Planned Schedule
All sessions are delivered in person.
| Week | Topics | ILO | Readings | Activities |
|---|---|---|---|---|
| 1 | Course Introduction; Lecture 1 (Introduction to Semiconductor Technology) | SPT 1-2 | Lecture note 1 | |
| 2 | Lectures 2 (Semiconductor Wafer) and 3 (Lithography Techniques) | SPT 3-4 | Lecture notes 2 and 3 | |
| 3 | Lecture 3 | SPT 4 | Lecture note 3 | Lab Demo |
| 4 | Lecture 3 | SPT 4 | Lecture note 3 | Tutorial Lab Demo |
| 5 | Lecture 4 (Etching) | SPT 5 | Lecture note 4 | Lab Demo |
| 6 | Lecture 5 (Thin Film Deposition Techniques) | SPT 6-7 | Lecture note 5 | Tutorial Lab Demo |
| 7 | Lecture 5; Test 1 | SPT 6-7 | Lecture note 5 | Test 1 |
| 8 | Lectures 6 (Impurity Doping) and 7 (Metallisation) | SPT 8-9 | Lecture notes 6 and 7 | |
| 9 | Lecture 7 | SPT 9 | Lecture note 7 | Tutorial |
| 10 | Lecture 8 (Semiconductor Back-end Process and Yields) | SPT 10 | Lecture note 8 | |
| 11 | Test 2; Lecture 9 (CMOS Device Fabrication) | SPT 11 | Lecture note 9 | Test 2 |
| 12 | Lecture 9; Revision | SPT 11 | Lecture note 9 | Tutorial |
| 13 | Final Examination | SPT 1-11 | All lecture notes | Final Exam |
Learning and Teaching Approach
| Approach | How It Supports the Learning Outcomes |
|---|---|
| Lectures | Introduction of new concepts, content discussion and derivations, examples of problem solving, and discussion of conceptual understanding. |
| Lab Demonstrations | Students are brought into the cleanroom laboratory to observe the microfabrication process and to learn the techniques through demonstration. |
| Tutorials | Review and discussion of key concepts from lectures by working through problems. |
| Assignment Project | A literature survey on a topic relevant to the course, such as microfabrication or semiconductor devices. Students have the option to work with a partner on the same topic and give a joint presentation. |
| Technology-enhanced Learning | Extended learning is facilitated by online learning videos and other materials, including recorded lectures and videos of techniques and processes. |
Assessment
| Assessment Component | ILO Tested | Weightage | Format |
|---|---|---|---|
| Final Examination | All | 45% | Individual, point-based marking |
| CA1: Assignment Report and Presentation | All | 25% | Individual, rubric marking |
| CA2: Multiple Tests (Tests 1 and 2) | All | 30% | Individual, point-based marking |
Assignment (CA1)
- Conduct a literature survey on one of the listed topics, or a self-proposed topic relevant to microelectronic devices or microfabrication, and write an assignment report on the survey.
- Report length: 3,500 to 20,000 words. Every student must submit a report.
- Each student gives a 20-minute in-person presentation. Two students with similar surveyed topics may opt for a joint presentation of 30 minutes.
- The report is assessed on: quality of write-up; structure and organisation; quality of information gathering and references; presentation and discussion of surveyed information; and logical analysis and conclusion.
- The presentation is assessed on: quality of work presented; ability to give technical explanations; quality of presentation materials; clarity, language use and accuracy; and questions and answers.
Formative Feedback
- Weekly feedback through interactions during lectures, lab demonstrations and tutorials, including discussion of the progress, pace and difficulty level of the course content.
- Feedback after each term test on students' understanding of the content, including common mistakes.
- Key features of past examination questions and the examiner's report are discussed in lectures.
- Feedback on the assignment presentation to help improve presentation skills.
- The course instructor, teaching associate and lab demonstrators are available for individual or group consultation through email or personal discussion.
Reference Books
2. J. D. Plummer, M. D. Deal and P. B. Griffin, Silicon VLSI Technology: Fundamentals, Practice and Modeling, Prentice Hall (2000).
3. S. M. Sze, Semiconductor Devices: Physics and Technology, Wiley (2002).
4. R. Doering and Y. Nishi (eds.), Handbook of Semiconductor Manufacturing Technology, CRC Press (2008).
5. M. J. Madou, Fundamentals of Microfabrication and Nanotechnology, Vol. II: Manufacturing Techniques for Microfabrication and Nanotechnology, 3rd ed., CRC Press (2011). ISBN 978-1420055191.
6. S. Franssila, Introduction to Microfabrication, 2nd ed., Wiley (2010). ISBN 978-0470749838.
7. C. C. Hu, Modern Semiconductor Devices for Integrated Circuits, Prentice Hall (2009). ISBN 978-0137006687.
These are the foundational readings for the course. More up-to-date readings will be provided when available.
Course Policies
General. Students are expected to complete all assigned pre-class readings and activities, and to attend all lectures, lab demonstrations and tutorials punctually. Attendance at all scheduled tests and assignment presentations is required. Lecture notes and relevant reference materials are available on NTULearn.
Absence. Frequent absence from class compromises understanding of the course. Absence with valid reasons is accepted, for example illness certified by a local medical practitioner, or participation in NTU-approved activities supported by an excuse letter from the School, Hall or Society. If you must miss a test for a valid reason, please inform the instructor by email before the test.
Academic Integrity. Students are expected to uphold the NTU Honour Code, built on the shared values of Truth, Trust and Justice, and to avoid all forms of academic dishonesty, including plagiarism, academic fraud, collusion and cheating. Not knowing what academic integrity involves does not excuse academic dishonesty. Consult the instructor if you need any clarification about the requirements of academic integrity in the course.